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Please use this identifier to cite or link to this item: http://hdl.handle.net/1807/25462

Title: PCM Thermal Control Unit for Portable Electronic Devices: Experimental and Sumerical Studies
Authors: Amon, C. H.
Alawadhi, E. M.
Keywords: numerical analysis
phase transformations
thermal analysis
thermal conductivity
thermal management (packaging)
thermal variables control
PCM thermal control unit
Stefan number
heat source power
latent heat modeling
numerical model
numerical predictions
organic phase change material
portable electronic devices
thermal conductivity enhancer
thermal management
thermo-physical properties
Issue Date: Mar-2003
Publisher: IEEE
Citation: Alawadhi EM, Amon CH. PCM thermal control unit for portable electronic devices: Experimental and numerical studies. IEEE Transactions on Components and Packaging Technologies. 2003;26(1):116-25.
Series/Report no.: IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
Vol. 26 No.1
Abstract: This paper investigates the effectiveness of a thermal control unit (TCU) for portable electronic devices by performing experimental and numerical analyses. The TCU objective is to improve thermal management of electronic devices when their operating time is limited to a few hours. It is composed of an organic phase change material (PCM) and a thermal conductivity enhancer (TCE). To overcome the relatively low thermal conductivity of the PCM, a TCE is incorporated into the PCM to boost its conductivity. The TCU structure is complex, and modeling an electronic device with it requires time and effort. Hence, this research develops approximate, yet effective, solutions for modeling the TCU, which employ effective thermo-physical properties. The TCU component properties are averaged and a single TCU material is considered. This approach is evaluated by comparing the numerical predictions with the experimental results. The numerical model is then used to study the effect of important parameters that are experimentally expensive to examine, such as the PCM latent heat, Stefan number, and heat source power. It is shown that the TCU can provide a reliable solution to portable electronic devices, which avoids overheating and thermally-induced fatigue, as well as a solution which satisfies the ergonomic requirement.
Description: Reproduced in this open access repository with permission from IEEE. IEEE allows authors' own work to be made publicly accessible on employer's webpage. IEEE holds all copyright to this article.
URI: http://dx.doi.org/10.1109/TCAPT.2003.811480
http://hdl.handle.net/1807/25462
http://ieeexplore.ieee.org/search/srchabstract.jsp?tp=&arnumber=1202910&queryText%3DPCM+thermal+control+unit+for+portable+electronic+devices%26openedRefinements%3D*%26searchField%3DSearch+All
ISSN: 1521-3331
Appears in Collections:Faculty of Applied Science and Engineering Office of the Dean

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