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Please use this identifier to cite or link to this item: http://hdl.handle.net/1807/25463

Title: Thermal Management and Concurrent System Design of a Wearable Multicomputer
Authors: Amon, C. H.
Egan, E. R.
Smailagic, A.
Siewiorek, D. P.
Keywords: concurrent engineering
cooling
heat sinks
portable computers
temperature distribution
Navigator2
active power saving
aircraft inspection
computational model
computerized maintenance manual
concurrent system design
conductive elastomer
dual architecture
electronic component
heat spreader
liquid heat sink
numerical simulation
semi-custom electronic design
speech recognition
spread spectrum radio
temperature distribution
thermal contact interface
thermal management
variable gain amplifier head-mounted display
wearable multicomputer
Issue Date: Jun-1997
Publisher: IEEE
Citation: Amon CH, Egan ER, Smailagic A, Siewiorek DP. Thermal management and concurrent system design of a wearable multicomputer. IEEE Transactions on Components Packaging and Manufacturing Technology Part A. 1997;20(2):128-37.
Series/Report no.: IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY
Vol. 20 No. 2
Abstract: This paper describes the concurrent system design and thermal management of the Navigator2 which is used as a computerized maintenance manual for aircraft inspection with speech recognition capabilities. The Navigator2 is a wearable computer that includes a novel dual architecture, spread spectrum radio, and variable gain amplifier (VGA) head-mounted display. The semi-custom electronic design includes two electronic boards-a custom designed system board and a 486-based processor board. The system board captures glue logic functions and provides support for two PCMCIA slots, a power management microcontroller, memory backup batteries, and a power supply. The thermal design of the Navigator2 develops concurrently with the overall design in a series of stages. A framework of concurrent thermal engineering consisting of three basic stages is used to maintain interdisciplinary interaction while satisfying thermal design goals. In the first stage of the thermal design, a cooling arrangement that meets the needs of other disciplines is proposed, and an enhanced-conduction thermal design with aluminum heat spreaders and active power-saving is explored. In the second stage, the thermal contact between heat spreaders and electronic components is optimized, and physical experimentation is performed with liquid heat sinks and conductive elastomers as thermal contact interfaces. In the third stage, numerical simulations are performed to ascertain the effectiveness of the thermal design, giving the thermal designer flexibility to change critical parameters and perform sensitivity analyses. A simplified computational model is used to investigate the performance of thermal interface devices and the effect of the heat spreader design on the maximum electronic component temperatures. Although the simplified model proves adequate for thermal design purposes, a detailed geometrically-accurate computational model assesses the adequacy of the exposed heat spreader surface area and predicts temperature distributions with better agreement to the experimental measurements on the Navigator2
Description: Originally published in IEEE Transactions on Components and Packaging Technology Vol. 20 No. 2. IEEE holds all copyright of this article. IEEE allows the final published version of author's own work to be deposited in institutional repositories.
URI: http://ieeexplore.ieee.org/search/srchabstract.jsp?tp=&arnumber=588564&queryText%3DThermal+Management+and+Concurrent+System+Design+of+a+Wearable+Multicomputer%26openedRefinements%3D*%26searchField%3DSearch+All
http://dx.doi.org/10.1109/95.588564
http://hdl.handle.net/1807/25463
ISSN: 1070-9886
Appears in Collections:Faculty of Applied Science and Engineering Office of the Dean

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