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Please use this identifier to cite or link to this item: http://hdl.handle.net/1807/25464

Title: Foreword - Special Issue on Emerging Technologies
Authors: Amon, C. H.
Goodson, K.
Luo, G.
Issue Date: Jun-2003
Publisher: IEEE
Citation: Amon CH, Goodson K, and Luo G-. Foreword– special issue on emerging technologies. IEEE Transactions on Components and Packaging Technologies. 2003;26(2):307-8.
Series/Report no.: IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
Vol. 26 No. 2
Abstract: ITherm 2002, the 8th Intersociety Conference on Thermal, Mechanical and Thermomechanical Phenomena in Electronic Systems, hosted about 500 international experts in the areas of thermal management, thermomechanical and mechanics issues, and emerging technologies in electronic packaging and systems, from May 30 to June 1, 2002, in San Diego, CA. The Technical Program included nearly 150 peer-reviewed papers presented in 35 sessions arranged into three Tracks: Thermal Management, Applied Mechanics, and Emerging Technologies. The area of Emerging Technologies brought together engineers and scientists from industry, academia and government research organizations for exploration of emerging technology issues on electronic systems. There were 4 sessions in the Emerging Technologies area and each session had a nomination for the ITherm 02 Emerging Tech. track best paper. Of the nine papers selected for this Special Issue, four have been accepted for publication after peer review. These papers deal with wide ranging issues on emerging technologies; from thermosciences, heat transfer in Bio-MEMS, analysis and simulation of anode heating, to investigations of thermal responses of MEMS components.
Description: Originally published in IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 26, NO. 2, JUNE 2003. IEEE holds all copyright of this article. IEEE allows the final published version of author's own work to be deposited in institutional repositories.
URI: http://ieeexplore.ieee.org/search/srchabstract.jsp?tp=&arnumber=1218225&queryText%3DForeword+Special+Issue+on+Emerging+Technologies%26openedRefinements%3D*%26searchField%3DSearch+All
http://dx.doi.org/10.1109/TCAPT.2003.816231
http://hdl.handle.net/1807/25464
ISSN: 1521-3331
Appears in Collections:Faculty of Applied Science and Engineering Office of the Dean

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