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Please use this identifier to cite or link to this item: http://hdl.handle.net/1807/25476

Title: Computation of Natural Convection in Channels With Pin Fins
Authors: Boyalakuntla, D. S.
Murthy, J. Y.
Amon, C. H.
Keywords: approximation theory
channel flow
cooling
finite volume methods
flow simulation
natural convection
3D channels
Boussinesq approximation
Nusselt numbers
Rayleigh numbers
augmented cooling schemes
axial mean flow direction
buoyant flow
display channel
display panel
electronics cooling
embedded pin fin arrays
global flow
heat flux boundary condition
heat transfer
inner wall temperature condition
lateral direction
local flow
local temperature
panel inclinations
periodic module
pin fin arrangements
pin fin spacing
unstructured finite volume method
velocity fields
Issue Date: Mar-2004
Publisher: IEEE
Citation: Boyalakuntla DS, Murthy JY, Amon CH. Computation of natural convection in channels with pin fins. IEEE Transactions on Components and Packaging Technologies. 2004;27(1):138-46.
Series/Report no.: IEEE Transactions on Components and Packaging Technologies
Vol. 27 No. 1
Abstract: In this paper, we numerically analyze the possibility of using buoyant flow in the display panel of a laptop for electronics cooling. Three-dimensional (3-D) channels with embedded pin fin arrays are analyzed using an unstructured finite volume method. Studies have been performed with a uniform heat flux boundary condition applied on the inner wall as well as for a constant inner wall temperature condition; the outer wall in all cases is exposed to the ambient. A single periodic module is selected in the lateral direction. In the axial mean flow direction, however, the entire height of the display channel is considered. Buoyancy has been modeled using Boussinesq approximation. A range of Rayleigh numbers, panel inclinations, and pin fin arrangements are considered. Local and global flow and heat transfer results are obtained including Nusselt numbers as well as local temperature and velocity fields. The results are useful in designing augmented cooling schemes in portable electronics.
Description: Originally published in IEEE Transactions on Components and Packaging Technology Vol. 27 No. 1. IEEE holds all copyright of this article. IEEE allows the final published version of author's own work to be deposited in institutional repositories.
URI: http://ieeexplore.ieee.org/search/srchabstract.jsp?tp=&arnumber=1288317&queryText%3DComputation+of+natural+convection+in+channels+with+pin+fins%26openedRefinements%3D*%26searchField%3DSearch+All
http://dx.doi.org/10.1109/TCAPT.2004.825751
http://hdl.handle.net/1807/25476
ISSN: 1521-3331
Appears in Collections:Faculty of Applied Science and Engineering Office of the Dean

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