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Please use this identifier to cite or link to this item: http://hdl.handle.net/1807/25477

Title: Special Section on Components and Packaging Technologies With Contributions From ITherm 2002 Thermal Management Track
Authors: Amon, C. H.
Ramakrishna, K.
Sammakia, B. G.
Joshi, Y. K.
Issue Date: Mar-2003
Publisher: IEEE
Citation: Amon CH, Ramakrishna K, Sammakia BG, Joshi YK. Special section on components and packaging technologies with contributions from ITherm 2002 thermal management track. IEEE Transactions on Components and Packaging Technologies. 2003;26(1):3-5.
Series/Report no.: IEEE Transactions on Components and Packaging Technologies
Vol. 26 No. 1
Abstract: ITHERM 2002, the 8th Intersociety Conference on Thermal, Mechanical and Thermomechanical Phenomena in Electronic Systems, hosted approximately 500 international experts in the areas of thermal management, thermomechanical and mechanics issues, and emerging technologies in electronic packaging and systems in San Diego, CA, May 30–June 1, 2002. The Technical Program included nearly 150 peer-reviewed papers presented in 35 sessions arranged into three Tracks: Thermal Management, Applied Mechanics, and Emerging Technologies. Twenty-five of these sessions were in the area of Thermal Management. This represented an increase in the number of presented papers and attendance compared with ITherm 2000, in spite of an economic downturn in the intervening period. Three special issues of the CPMT IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES have been planned, one for each Track. The papers appearing in this Special Issue are in the area of thermal management and have been nominated by session chairs for consideration for the ITherm 2002 Best Paper in the Thermal Management Track. In addition, three of the six Keynote Speeches have also been included in this Special Issue. These papers reflect a broad range of current interest topics covered in the area of thermal management at ITherm 2002. Of the sixteen papers selected for this Special Issue, eleven have been accepted for publication after peer review.
Description: Originally published in IEEE Transactions on Components and Packaging Technology Vol. 26 No. 1. IEEE holds all copyright of this article. IEEE allows the final published version of author's own work to be deposited in institutional repositories.
URI: http://ieeexplore.ieee.org/search/srchabstract.jsp?tp=&arnumber=1202897&queryText%3DSpecial+section+on+components+and+packaging+technologies+with+contributions+from+ITherm+2002+thermal+management+track%26openedRefinements%3D*%26searchField%3DSearch+All
http://dx.doi.org/10.1109/TCAPT.2003.810756
http://hdl.handle.net/1807/25477
ISSN: 1521-3331
Appears in Collections:Faculty of Applied Science and Engineering Office of the Dean

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