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Please use this identifier to cite or link to this item: http://hdl.handle.net/1807/25478

Title: Bayesian surrogates for integrating numerical, analytical and experimental data: application to inverse heat transfer in wearable computers
Authors: Leoni, N.
Amon, C.
Keywords: Bayes methods
heat transfer
portable computers
thermal conductivity
thermal management (packaging)
thermal resistance
cooling
Issue Date: Mar-2000
Publisher: IEEE
Citation: Leoni N, Amon CH. Bayesian surrogates for integrating numerical, analytical, and experimental data: Application to inverse heat transfer in wearable computers. IEEE Transactions on Components and Packaging Technologies. 2000;23(1):23-32.
Series/Report no.: IEEE Transactions on Components and Packaging Technologies
Vol. 23 No. 1
Abstract: Wearable computers are portable electronics worn on the body. The increasing thermal challenges facing these compact electronics systems have motivated new cooling strategies such as transient thermal management with thermal storage materials. The ability of building models to assess quickly the effect of different design parameters is critical for effectively incorporating innovative thermal strategies into new products. System models that enable design space exploration are built from different information sources such as numerical simulations, physical experiments, analytical solutions and heuristics. These models, called surrogates, are nonlinear, adaptive, and suitable for system responses where limited information is available and few realizations of experiments or numerical simulations are feasible. This paper applies a Bayesian surrogate framework to estimate values for unknown physical parameters of an embedded electronics system. Physical experiments and numerical simulations are performed on an embedded electronics prototype system of a wearable computer. Numerical models for the experimental prototype, which involve five and three unknown parameters, are implemented with and without thermal contact resistances. Through the use of orthogonal arrays and optimal sampling, an efficient exploration of the parameter space is performed to determine thermal conductivities, thermal contact resistances and heat transfer coefficients. Surrogate models are built that combine information obtained from numerical simulations, experimental model measurements and a thermal resistance network. The integration of several information sources reduces the number of large-scale numerical simulations needed to find reliable estimates of the system parameters. For the embedded electronics case, the use of prior information from the thermal resistance network model reduces significantly the computational effort required to investigate the solution space
Description: Originally published in IEEE Transactions on Components and Packaging Technology Vol. 23 No. 1. IEEE holds all copyright of this article. IEEE allows the final published version of author's own work to be deposited in institutional repositories.
URI: http://ieeexplore.ieee.org/search/srchabstract.jsp?tp=&arnumber=833038&queryText%3DBAYESIAN+SURROGATES+FOR+INTEGRATING+NUMERICAL%2C+ANALYTICAL+AND+WEARABLE+COMPUTERS+EXPERIMENTAL+DATA%3A+APPLICATION+TO+INVERSE+HEAT+TRANSFER+IN%26openedRefinements%3D*%26searchField%3DSearch+All
http://dx.doi.org/10.1109/6144.833038
http://hdl.handle.net/1807/25478
ISSN: 1521-3331
Appears in Collections:Faculty of Applied Science and Engineering Office of the Dean

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