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|Title: ||Electroless Copper Deposition: A Sustainable Approach|
|Authors: ||Kutnahorsky, Marika Renée|
|Advisor: ||Thorpe, Steven J.|
Kirk, Donald W.
|Department: ||Materials Science and Engineering|
|Keywords: ||copper plating|
|Issue Date: ||30-Nov-2011|
|Abstract: ||A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was then developed using a simple copper sulfate chemistry inhibited with quinine to extend the possible operating window. Finally, benzotriazole was evaluated as a possible anti-oxidant coating. Accelerated thioacetamide corrosion tests were used to evaluate the corrosion inhibition of benzotriazole on copper coatings.|
|Appears in Collections:||Master|
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